Concept

• This package, comprised of metal and glass, features high airtightness and excellent electrical properties.
• By leveraging the heat dissipation properties of metal, it provides stable output and long lifespan.
• It is ideal for devices requiring high reliability, such as semiconductor lasers and vehicle-mounted sensors.
• It is currently widely used for optical communications (high frequency) and industrial applications.

Structure

There are 「Matched Type」 and 「Compression Type」 depending on the difference in glass attachment method.

Matched Type

No	Parts	Texture
1	Eyelet	Kovar
2,3	Lead	Kovar
4	Glass	Hard Glass

Compression Type

No	Parts	Texture
1	Eyelet	Soft Steel
2,3	Lead	Alloy
4	Glass	Soda barium soft glass

CAP

No	Texture
1	Kovar/Alloy/SUS430FSM
2	Glass(Hard/Flat/Ball)

※ . We can manufacture various specifications according to customer requirements, such as No Glass Cap, Glass Cap, etc.

Performance

• High airtightness
  • - Matched Type: 1x10⁻¹⁰ Pa ㎥/sec or less
  • - Compression Type: 1x10⁻⁹ Pa ㎥/sec or less
• High electrical insulation properties
  • - 1x10¹⁰ Ω or more (DC 100V, R.T, 40±5%R.H)
• Wire bonding properties (Gold wire, Al) wire
• Soldering characteristics
• High-temperature resistance
• Durability, fatigue resistance (physical), etc.

Applications

• Transceivers for optical communication (VCSEL, TOSA, ROSA, FP, DFB, etc.)
• Various sensors, including optical sensors, vehicle sensors, and gas pressure sensors.
• For optical modules, such as PD (Photo Diode), LED, etc.
• For various industrial applications, such as barcode scanners and laser printers.
• For other transistors, ICs, etc.